Jung_ehd

: Creating ultra-thin mesh for touchscreens. 2. Biomedical Engineering

: Developing Redistribution Layers in chips. Solder Bumping : Precise placement of micro-solder balls. 🚀 Advantages of this Method No Clogging : Uses larger nozzles to produce smaller drops. Contactless : Prints on uneven or fragile surfaces. Jung_EHD

: Works with conductive inks, polymers, and biomaterials. 🛠️ Key Applications : Creating ultra-thin mesh for touchscreens

: Creates droplets far smaller than the nozzle itself. Jung_EHD